Home / Products / Integrated Circuits / KLM8G1GETF-B041
KLM8G1GETF-B041
Samsung · FBGA-153
Request BOM Quote

We do not sell online. Submit an inquiry and our sales team will reply with pricing and lead time.

KLM8G1GETF-B041 Samsung eMMC 5.1 Embedded Flash Memory, FBGA-153

Part Number: KLM8G1GETF-B041
Brand: Samsung · Package: FBGA-153
Category: Integrated Circuits
Stock: In Stock
Price: USD 20.28
ModelKLM8G1GETF-B041
BrandSamsung
CategoryIntegrated Circuits
PackageFBGA-153
Capacity8GB
ProtocoleMMC 5.1
Seq Read Speed330MB/s
Operating Temperature-25℃ ~ +85℃

This device comes in FBGA-153 tray package. Operating temperature range: -25℃ ~ +85℃, compliant with RoHS & REACH. External power and decoupling capacitors required. It is EOL discontinued, only spot stock available, lead time depends on inventory.

Related Components

DIP 20，SOP 20，DICE
Apr-60
Brand: APLUS
DIP 20，SOP 20，DICE
APR2060 APLUS voice recording playback IC with 16KB FLASH, 2.25KB RAM, 16 I/Os, 12bit ADC. Operating voltage 2.2~3.6V, …
USD 6.5
Details
MC14489BDWER2
MC14489BDWER2
Brand: NXP
SOIC-20
Multifunctional LED 7-segment display driver IC, SOIC-20 package. Communicates via synchronous serial SPI interface, in…
USD 4.84
Details
MFRC52202HN1,151
MFRC52202HN1,151
Brand: NXP
HVQFN-32
13.56MHz contactless RFID reader IC, HVQFN-32 (5×5mm) package. Supports ISO14443A and MIFARE protocol, with SPI, I2C an…
USD 0.94
Details
PN5180A0HN/C3E
PN5180A0HN/C3E
Brand: NXP
HVQFN-40
High-performance multi-protocol NFC frontend IC, operating at 13.56MHz, HVQFN-40 (6×6mm) package. Supports ISO14443, IS…
USD 2.11
Details